Non-destructive laboratory-based X-ray diffraction mapping of warpage in Si die embedded in IC packages

Non-destructive laboratory-based X-ray diffraction mapping of warpage in Si die embedded in IC packages

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 117, 1 April 2014, Pages 48-56

C.S. Wong, N.S. Bennett, D. Manessis, A. Danilewsky, P.J. McNally,