High density phase change data on flexible substrates by thermal curing type nanoimprint lithography

In this study, high density phase change nano-pillar device (Tera-bit per inch2 data density) was fabricated on flexible substrates by thermal curing type nanoimprint lithography with high throughput at a relatively low temperature (120 °C). Phase change nano-pillar was formed with on flexible poly (ethylene terephthalate) (PET) film, polyimide (PI) film, and stainless steel plate (SUS) substrate without any damage of substrate. The electrical property of the fabricated phase change nano-pillar device was confirmed by electrical signal measuring of conductive atomic force microscopy.