کد مقاله کد نشریه سال انتشار مقاله انگلیسی ترجمه فارسی نسخه تمام متن
538890 1450320 2016 4 صفحه PDF سفارش دهید دانلود رایگان
عنوان انگلیسی مقاله ISI
Fabrication of bottom-emitting organic light-emitting diode panels interconnected with encapsulation substrate by AuAu flip-chip bonding and capillary-driven filling process
ترجمه فارسی عنوان
ساخت پانل های دیود ساطع نور پایین آلی نور ساطع به هم پیوسته با زیرلایه کپسول سازی توسط پیوند تراشه تلنگر AuAu و روند پر شدن مویرگی‌محور
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کلمات کلیدی
دیود ساطع نور ارگانیک ماتریس فعال (AMOLED)؛ اسمبلی تلنگر تراشه ؛ باندینگ ویفر؛ اتصال AuAu در دمای پایین ؛ پر کردن مویرگی محور ؛ کپسوله سازی
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
چکیده انگلیسی


• OLED panel assembled by flip-chip bonding and capillary-driven filling is proposed.
• Assembly was successfully carried out at 100 °C with AuAu low temperature bonding.
• Stable current flow and electro-luminescence was obtained from assembled OLED panel.
• Flip-chip assembly is effective for fabricating OLED panel with large device area.

We present fabrication and testing of bottom-emitting organic light-emitting diode (OLED) panels based on flip-chip assembly and non-destructive scanning. In this method, the OLED and electric circuits are fabricated on separate substrates and interconnected by low temperature assembly to create a high-performance bottom-emitting OLED including other functions such as thin-film transistor (TFT) circuits. The low temperature assembly process consists of two steps. First, an OLED substrate and encapsulation glass with circuits are bonded at 100 °C via AuAu bond. Encapsulation glass is utilized for the functional substrate with circuits. Next, the bonded panel is sealed by capillary underfill within and by applying and curing seal materials to the panel edge. The fabricated OLED was non-destructively evaluated by scanning acoustic microscopy (SAM). The SAM image shows all φ500 μm Au bumps were bonded to Au pads, indicating that OLED and encapsulation substrates were assembled. Electroluminescence of the OLED was demonstrated by applying voltage. Stable current-luminance characteristics were obtained for the fabricated OLED with an operating voltage of 3.25 V. The results indicate that the proposed fabrication is available for bottom-emitting OLED controlled by TFT circuits. In future, the assembly process can be widely applied to other flexible organic electronic devices with roll assembly by altering OLED or circuits with other devices because this is a simple pressure method with low temperature, achieving encapsulation at same time.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 161, 1 August 2016, Pages 94–97
نویسندگان
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