Glass-to-glass anodic bonding using TiNx interlayers for fully transparent device applications

TiNx thin films reactively magnetron sputtered on glass surface are examined for anodic bonding of glass plates for fully transparent device applications. Using under-stoichiometric titanium nitride thin films 22–63 nm thick to bond the glass substrates makes it possible to apply approximately 10 min preheating time, 3 min bonding time, bonding temperature of 430 °C and 50–120 V voltage to obtain the seals of about 13.5–27.0 MPa tensile strength.