Thermal correction values for analysis of lineshape microstructure arrays

Thermal modeling of microelectromechanical systems is a major area of research with many different approaches and complexities. In this paper a simplified, reduced order model for thermal analysis of lineshape microstructure arrays, such as those used in thermal actuators, is explained. Finite element modeling of these arrays was performed to determine thermal correction (Kt) values for the simplified thermal model. An equation is developed to describe a general MEMS design space of the independent parameters for implementation of the simplified model. Error in the equation fit is quantified and the fit is validated. Application of the model is also shown for single microstructures. Implementation of the simplified model using a finite difference model is presented and validated, with errors in predicted temperature rise of less than 5.4%.