کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
763779 | 1462864 | 2015 | 4 صفحه PDF | دانلود رایگان |
• Ag serves as a promising bonding material for PbTe operating at THot ⩽ 400 °C.
• The Ag foils reacted vigorously with PbTe to form Ag2Te at 550 °C.
• The Seebeck coefficient of Ag/PbTe/Ag is slightly higher than that of pure PbTe.
• A cost-effective way for long-term operations at high temperature.
We use the rapid hot-pressing method to bond Ag foil onto pure PbTe in order to assess its effectiveness as a bonding layer material for thermoelectric module applications. Scanning electron microscopy and X-ray diffraction are employed to examine intermetallic compound formation and microstructure evolution during isothermal aging at 400 °C and 550 °C. We find that Ag is a promising bonding material for PbTe modules operating at THot ⩽ 400 °C. Additionally, our approach highlights a highly effective and inexpensive method to metallize PbTe prior to module assembly.
Journal: Energy Conversion and Management - Volume 98, 1 July 2015, Pages 134–137