Homogeneous (Cu, Ni)6Sn5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process

Homogeneous (Cu, Ni)6Sn5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Ultrasonics Sonochemistry - Volume 42, April 2018, Pages 403-410

Z.L. Li, H.J. Dong, X.G. Song, H.Y. Zhao, H. Tian, J.H. Liu, J.C. Feng, J.C. Yan,