The evolution of void defects in metallic films based on a nonlocal phase field model

• A non-local phase field model is found in diffusion layers of defects.
• The anisotropic diffusion of void surface on the evolution of the void is described.
• The stress and electric loads drive a void to move opposite the electric wind.
• The transversal stress induces the crack defect in interconnects to degenerate.

In this paper, a nonlocal phase field method is presented to solve anisotropic diffusion-driven morphological evolution and migration of void defects in finite metallic film interconnects by utilizing a nonlocal phase field model considering a small scale effect. The nonlocal elastic theory is used to describe a small scale effect on the morphological evolution and migration of the void. In example calculations, the effects of the stress field, the electric field, and the anisotropic diffusion characteristic on the evolution of void defects in finite metallic film interconnects are described and discussed. The result in comparison with literature shows that the small scale effect based on nonlocal elastic model induces the migration diffusion of the crack tip to decrease.

Influence of small scale parameters (e0ρ) on migration histories for the top point of crack defect.Figure optionsDownload as PowerPoint slide