کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
773586 | 1463531 | 2008 | 10 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Mode I fracturing properties of epoxy bonding paste
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
سایر رشته های مهندسی
مهندسی مکانیک
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
The wedge-splitting method by Tschegg was applied for the investigation of mode I fracture behavior of epoxy-based adhesives. Specific fracture energy and notch tensile strength of “traditional” thickened laminating resin were measured between −40 and +45 °C and compared to those of four new trial compounds. The adhesives in bulk were investigated as well as the interfaces between these adhesives and glass fiber-reinforced plastic. The wedge-splitting method has turned out suitable for epoxy resin. The quality of thickened laminating resin was not reached by the new trial compounds. Adherend pre-treatment with laminating resin and peel ply improved interfacial properties.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: International Journal of Adhesion and Adhesives - Volume 28, Issue 7, October 2008, Pages 340–349
Journal: International Journal of Adhesion and Adhesives - Volume 28, Issue 7, October 2008, Pages 340–349
نویسندگان
Elmar Karl Tschegg, Thomas Krassnitzer,