On the high strain rate behavior of 63–37 Sn–Pb eutectic solders with temperature effects

• Strain rate tests were carried out on a solder material at different temperatures.
• The effect on the dynamic yield stress was evaluated.
• Temperature rises as the consequence of the dynamic plastic deformation were calculated.
• A Johnson–Cook model was adopted and corresponding constants were determined.

This study presents experimental results performed on samples of Eutectic solder material (63 wt. % Sn 37 wt. % Pb) loaded at high strain rates and elevated temperatures. The tests were performed at high strain rates using Split Hopkinson Pressure Bar (SHPB). The strain rates were in the range of 400 s−1to 1300 s−1. Heating unit was added to conventional SHPB to vary sample's initial temperature conditions. Tests were conducted at three initial temperatures, i.e. room temperature, 60 °C and 120 °C for compressive mode. The effects of temperature on the behavior of material were compared. Transient temperature changes during dynamic loading conditions are calculated by an analytical approach using measured stress-strain data for plastic work. Test results were fitted into the Johnson–Cook model (JC model). In addition, dynamic tests were performed in tension mode using Split Hopkinson Tensile Bar (SHTB) at room temperature.