Nucleation and adhesion of ultra-thin copper films on amino-terminated self-assembled monolayers

Results consistent with these observations are obtained during conventional tape test measurements to determine adhesion. As such, for CMOS interconnect applications which require copper trenches with a nano-scale cross section, short chain SAMs offer excellent nucleation and adhesion, as well as the potential to act as a pore-sealant for low-k materials, without impacting significantly on the cross-sectional area of the copper lines.