Quantitative analysis of nano-defects in thin film encapsulation layer by Cu electrodeposition

Quantitative analysis of nano-defects in thin film encapsulation layer by Cu electrodeposition

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Surface Science - Volume 453, 30 September 2018, Pages 31-36

Kunmo Chu, Ki Deok Bae, Byong Gwon Song, Jaekwan Kim, Yong Young Park, Wenxu Xianyu, Chang Seung Lee, Yoonchul Sohn,