The nucleation-controlled intermetallic grain refinement of Cu-Sn solid-liquid interdiffusion wafer bonding joints induced by addition of Ni particles

The nucleation-controlled intermetallic grain refinement of Cu-Sn solid-liquid interdiffusion wafer bonding joints induced by addition of Ni particles

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Scripta Materialia - Volume 156, November 2018, Pages 1-5

Z.L. Li, H. Tian, H.J. Dong, X.J. Guo, X.G. Song, H.Y. Zhao, J.C. Feng,