کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
7922365 | 1511759 | 2018 | 5 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Electroless Ni-P metallization on palladium activated polyacrylonitrile (PAN) fiber by using a drying process
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
مواد الکترونیکی، نوری و مغناطیسی
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
Polyacrylonitrile (PAN) fiber was metallized by nickel-phosphorus (Ni-P) in an electroless plating process. Firstly, the surface of PAN fiber was activated by palladium (Pd) nanocatalysts by using a drying process in which palladium(II) bis(acetylacetonate), Pd(acac)2 was spontaneously reduced to Pd nanocatalysts in180 °C N2 atmosphere without using any reducing agent. And then Ni-P alloy was coated on the Pd activated PAN fiber in an electroless Ni-P plating solution without using SnCl2-sensitizing solution. The morphology was observed by scanning electron microscopy (SEM) and elemental analyses were carried out by energy dispersive spectroscopy (EDS) and X-ray photoelectron spectroscopy (XPS). The composition ratio of Ni: P was 85.3: 14.7 atomic % and the growth rate of Ni-P layer decreased with increasing plating time. The thickness of Ni-P plating layers for 10, 30 and 60 min were 0.64, 1.03 and 1.22 μm, respectively. Electromagnetic interference shielding effectiveness (EMI-SE) of Ni-P plated PAN fiber (50 wt%)/epoxy composite was more than 30 dB in the frequency range from 30 MHz to 1500 MHz.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Chemistry and Physics - Volume 204, 15 January 2018, Pages 257-261
Journal: Materials Chemistry and Physics - Volume 204, 15 January 2018, Pages 257-261
نویسندگان
Jae-Young Lee, Hong-Ki Lee,