کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
793571 | 902436 | 2009 | 7 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Local melting and shape controlling of solder joint via induction heating
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
سایر رشته های مهندسی
مهندسی صنعتی و تولید
پیش نمایش صفحه اول مقاله
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چکیده انگلیسی
A rapid yet simple methodology to form the solder joints used in electronic packaging has been demonstrated through an induction heating system in this paper. The objective is to control the shapes of the solder joints precisely and form the hourglass-shaped solder joint using local melting phenomenon. For Sn–Ag eutectic solder bullet-shaped solder bumps and hourglass-shaped solder joints can be obtained easily within 2.3 s. The reason for the formation of hourglass-shaped solder joints has been analyzed using different morphologies of Ag3Sn intermetallic compound (IMC), and is explained by the non-uniform temperature distribution caused by a local melting phenomenon and skin effect.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Materials Processing Technology - Volume 209, Issue 6, 19 March 2009, Pages 2781–2787
Journal: Journal of Materials Processing Technology - Volume 209, Issue 6, 19 March 2009, Pages 2781–2787
نویسندگان
Hongbo Xu, Mingyu Li, Jongmyung Kim, Daewon Kim,