Keywords: لحیم کاری; Silver oxalate; Silver nanoparticles; Paramagnetic silver; Oxalate decomposition; Nanocrystalline metal; Soldering;
مقالات ISI لحیم کاری (ترجمه نشده)
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در صورتی که به ترجمه آماده هر یک از مقالات زیر نیاز داشته باشید، می توانید سفارش دهید تا مترجمان با تجربه این مجموعه در اسرع وقت آن را برای شما ترجمه نمایند.
Keywords: لحیم کاری; Ceramic; Wear resistant; Soldering; Brazing; Aluminum brake disc
Keywords: لحیم کاری; Die casting; Hard coatings; H13 tool steel; Soldering; Sticking; Aluminum adhesion test
Keywords: لحیم کاری; Joining technology; Anodic bonding; Soldering; VIG;
Keywords: لحیم کاری; Finite element analysis; Ultrasonic vibration; Soldering; Cavitation; Oxide film;
Keywords: لحیم کاری; Soldering; Lead-free solder; Intermetallic compounds; Interfacial reactions; Nanocomposite solders
Keywords: لحیم کاری; Organic vertical transistor; Soldering; Tin micro-balls; Organic light-emitting diode; Space-charge-limited transistor;
Keywords: لحیم کاری; Soldering; Battery assembly; Contact and connection resistance; Lithium-ion battery cell; Equivalent electric circuit model;
Application of interlayers in the soldering process of graphite composite to aluminium alloy 6060
Keywords: لحیم کاری; Interlayer; Graphite composite; Soldering; Electroplating; Cold spray coating;
Microstructural evolution of SiC joints soldered using Zn-Al filler metals with the assistance of ultrasound
Keywords: لحیم کاری; SiC ceramic; Soldering; Ultrasound; Grain refining; Eutectic phase;
Micro-EDXRF, SEM-EDS and OM characterisation of tin soldering found in handle attachments of Roman situlae from Conimbriga (Portugal)
Keywords: لحیم کاری; Soldering; Tin; Copper alloys; Microstructure; Roman; Western Iberia;
Conductive-paste-based high-yielding interconnection process for c-Si photovoltaic modules with 50â¯Âµm thin cells
Keywords: لحیم کاری; C-Si photovoltaic module; Thin c-Si PV cell; Interconnection; Soldering; Conductive paste; Cell-string free;
Microstructure evolution of SiC/SiC joints during ultrasonic-assisted air bonding using a Sn-Zn-Al alloy
Keywords: لحیم کاری; Ceramic; Soldering; Ultrasonic; Interfacial reaction; Shear strength;
On the initial stages of solid state reactions in Ni/Sn-Ag solder system at 150-210â¯Â°C
Keywords: لحیم کاری; Soldering; Ni3Sn4 phase; Growth kinetics; Interface reaction; Grain boundary diffusion;
Wetting and spreading kinetics of liquid Sn on Ag and Ag3Sn substrates
Keywords: لحیم کاری; Wetting; Kinetics; Interfaces; Soldering; Ag3Sn;
Non-destructive micro-analytical system for the study of the manufacturing processes of a group of gold jewels from “El Carambolo” treasure
Keywords: لحیم کاری; Portable micro-XRF; Gold jewelry; Soldering; El Carambolo; Tartesic;
In-situ non-destructive analysis of Etruscan gold jewels with the micro-XRF transportable spectrometer from CNA
Keywords: لحیم کاری; Transportable micro-XRF; Polycapillary optics; Etruscan; Gold jewels; Welding; Soldering; Gold metallurgy; 00-01; 99-00;
Nucleation of tin on the Cu6Sn5 layer in electronic interconnections
Keywords: لحیم کاری; Heterogeneous nucleation of phase; 3D characterization; EBSD; Soldering;
Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections
Keywords: لحیم کاری; Crystal growth; 3D characterization; EBSD; Soldering; Synchrotron radiation;
Interactions at the planar Ag3Sn/liquid Sn interface under ultrasonic irradiation
Keywords: لحیم کاری; Soldering; Ultrasonic; Intermetallic compounds; Dissolution; Thermal grooving;
Intermetallic compounds in solar cell interconnections: Microstructure and growth kinetics
Keywords: لحیم کاری; Photovoltaic module; Interconnection; Soldering; Intermetallic compounds;
Enhancement of Cu pillar bumps by electroless Ni plating
Keywords: لحیم کاری; Joining; Soldering; Intermetallic compounds; Electroless plating; Cu pillar bump;
Suppression effect of Ni grain size on the Ni3Sn4 growth at the Sn/Ni interface
Keywords: لحیم کاری; Electroplating; Soldering; Intermetallic compounds; Nickel;
Joining of AL-6016 to Al-foam using Zn-based joining materials
Keywords: لحیم کاری; Al-Foam Sandwich (AFS); Soldering; Automotive; Aerospace;
The effect of aging temperature on the phenomena occurring at the interface of solder SnZn with Na on Cu substrate
Keywords: لحیم کاری; Aging; Soldering; Intermetallic compounds; Lead-free solder;
Fine grained Cu film promoting Kirkendall voiding at Cu3Sn/Cu interface
Keywords: لحیم کاری; Kirkendall voiding; Grain size; Intermetallic compounds; Diffusion; Soldering;
In situ study on interfacial reactions of Cu/Sn-9Zn/Cu solder joints under temperature gradient
Keywords: لحیم کاری; Synchrotron radiation; Soldering; Thermomigration; Interfacial reaction; Grain orientation; Intermetallic compound;
Flux effect on void quantity and size in soldered joints
Keywords: لحیم کاری; Assembly manufacturing; Reliability; Soldering; Voids; Flux
Growth characteristics and formation mechanisms of Cu6Sn5 phase at the liquid-Sn0.7Cu/(111)Cu and liquid-Sn0.7Cu/(001)Cu joint interfaces
Keywords: لحیم کاری; Intermetallic compounds; Microstructure formation mechanism; Cu single crystal; Orientation; Soldering
Formation of Cu6Sn5 phase by cold homogenization in nanocrystalline Cu–Sn bilayers at room temperature
Keywords: لحیم کاری; Cu/Sn nanostructured thin film; Solid state reactions; Soldering; SNMS depth profiling
Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis
Keywords: لحیم کاری; Assembly manufacturing; Flux spattering; In-circuit test; Reliability; Scanning electron microscopy; Soldering
Effect of Ni to the Cu substrate on the interfacial reaction with Sn-Cu solder
Keywords: لحیم کاری; Soldering; Interface; Diffusion; Thermodynamic modeling; Local equilibrium; Cu3Sn
Soldering aluminium to copper with the use of interlayers deposited by cold spraying
Keywords: لحیم کاری; Cold spray; Soldering; Interlayers; Aluminium coatings; Copper coatings
Growth kinetic of Ag3Sn intermetallic compound in micro-scale Pb-free solder alloys under a temperature gradient
Keywords: لحیم کاری; Intermetallic compound; Soldering; Diffusion; Growth kinetics; Thermomigration;
Reactive phase formation and isothermal solidification in the Ni/Au-18.6Si/Ni layer system
Keywords: لحیم کاری; Au-Ni-Si phase diagram; Isothermal solidification; TLP-bonding; Soldering;
Thermal and mechanical properties of lead-free SnZn–xNa casting alloys, and interfacial chemistry on Cu substrates during the soldering process
Keywords: لحیم کاری; Sn-Zn-Na; Microstructure; Mechanical and thermal properties; Spreading; Soldering; Activation energy
A Comprehensive Study of Intermetallic Compounds in Solar Cell Interconnections and their Growth Kinetics
Keywords: لحیم کاری; Photovoltaic module; Interconnection; Soldering; Intermetallic compounds; Intermetallic phase growth; Activation energy; Reliability;
Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review
Keywords: لحیم کاری; Soldering; Cu6Sn5; Crystal structure; Phase transformation; Solidification; Thermo-mechanical properties;
Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces
Keywords: لحیم کاری; Soldering; Synchrotron radiation; Intermetallic compounds; Phase transformations; Kinetics;
The atomic behavior during heating in the amorphous diffusion nanolayer between Cu and solder
Keywords: لحیم کاری; Amorphous layer; Interfacial diffusion region; Dynamic behavior of atoms; In situ HRTEM; Soldering;
Effect of Pd(P) thickness on the soldering reaction between Sn–3Ag–0.5Cu alloy and ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad
Keywords: لحیم کاری; Copper pads; Ultrathin nickel–phosphorus; Palladium–phosphorus thickness; Nickel–tin–phosphorus; Soldering; High-resolution transmission electron microscopy
Soldering of aluminium with copper and steel using intermediate layer Zn–Ni
Keywords: لحیم کاری; Soldering; Dissimilar-metal joints; Wettability; Spreadability; Intermediate layer
Fabrication and mechanical characterization of 3D woven Cu lattice materials
Keywords: لحیم کاری; Lattice materials; Architected materials; Soldering; 3D woven structure; Mechanical properties
Improved adhesion of Ni/Cu/Ag plated contacts with thermally formed nickel silicon interface for C-SI solar cells
Keywords: لحیم کاری; Solar cell; Nickel/copper; Front contacts; Soldering; Adhesion;
Differences in the interfacial reaction between Cu substrate and metastable supercooled liquid Sn-Cu solder or solid Sn-Cu solder at 222 °C: Experimental results versus theoretical model calculations
Keywords: لحیم کاری; Soldering; Undercooling; Metastable liquid solder; Cu6Sn5; Growth kinetics; Interface reaction; Differential Scanning Calorimetry;
Global progress in photovoltaic technologies and the scenario of development of solar panel plant and module performance estimation â Application in Nigeria
Keywords: لحیم کاری; Cell-to-module assembly; Energy conversion; Module performance; Lean manufacturing; Sun simulation; Soldering;
In situ study of the real-time growth behavior of Cu6Sn5 at the Sn/Cu interface during the soldering reaction
Keywords: لحیم کاری; Soldering; Synchrotron radiation; Interfacial reaction; Intermetallic compounds; Kinetics;
Metallurgical characterization of experimental Ag-based soldering alloys
Keywords: لحیم کاری; Soldering; Ag-based alloys; Microstructure; DSC; SEM; EDX; XRD
Thermal and mechanical effects of voids within flip chip soldering in LED packages
Keywords: لحیم کاری; Flipâchip LED; Soldering; Thermal properties; Simulation;
Effects of silver addition on Cu-Sn microjoints for chip-stacking applications
Keywords: لحیم کاری; Microjoints; Chip-stacking; Soldering; Interfacial reactions;