کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
7913209 1510903 2015 4 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces
چکیده انگلیسی
In situ observations of the reaction between solid Cu in contact with molten Sn-0.7 wt.% Cu were achieved using a synchrotron X-ray imaging technique. It was found that, upon wetting, the rapid dissolution of Cu adjacent to the solid-liquid interface was followed by near-instantaneous interfacial intermetallic compound (IMC) formation. The kinetics of IMC formation were also elucidated. The results provide direct experimental evidence of the sequence of events in the dissolution reaction and subsequent diffusion, and in particular of the growth mechanisms of the IMC layer.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Scripta Materialia - Volume 100, 15 April 2015, Pages 17-20
نویسندگان
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