Differences in the interfacial reaction between Cu substrate and metastable supercooled liquid Sn-Cu solder or solid Sn-Cu solder at 222 °C: Experimental results versus theoretical model calculations

Differences in the interfacial reaction between Cu substrate and metastable supercooled liquid Sn-Cu solder or solid Sn-Cu solder at 222 °C: Experimental results versus theoretical model calculations

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Acta Materialia - Volume 99, 15 October 2015, Pages 106-118

O. Yu Liashenko, F. Hodaj,