کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
6946896 | 1450547 | 2014 | 6 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Thermal and mechanical effects of voids within flip chip soldering in LED packages
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی کامپیوتر
سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
This paper investigates the effect of void percentage in the solder layer on the shear strength and thermal property of DA3547 packages by SAC soldering technology. X-ray observation and shear tests revealed that the increase of solder paste volume significantly decreases the void percentage in the solder layer and thus improved the shear strength of the packages. Furthermore, packages with lower void percentage showed a lower junction temperature based on the results of IR test and finite element simulation. The temperature difference due to the effect void percentage shows a correlation with the input power. For the DA3547 packages studied in this research, voids show limited influence on the junction temperature under 50Â mA, the typical current recommended by Cree.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 54, Issues 9â10, SeptemberâOctober 2014, Pages 2028-2033
Journal: Microelectronics Reliability - Volume 54, Issues 9â10, SeptemberâOctober 2014, Pages 2028-2033
نویسندگان
Yang Liu, Stanley Y.Y. Leung, Jia Zhao, Cell K.Y. Wong, Cadmus A. Yuan, Guoqi Zhang, Fenglian Sun, Liangliang Luo,