کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1610976 | 1516288 | 2014 | 6 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Effects of silver addition on Cu-Sn microjoints for chip-stacking applications
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فلزات و آلیاژها
پیش نمایش صفحه اول مقاله
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چکیده انگلیسی
The solid-state reactions under confined space between Cu substrate and Sn and Sn-Ag solders are systematically investigated, with the objective of providing fundamental data that are critical to the design of robust microjoints for chip-stacking applications. Sandwich structures of Cu/Sn/Cu and Cu/Sn3.5Ag/Cu are prepared by thermal compression bonding. The thickness of Sn and Sn3.5Ag layer is controlled at 10 μm. High temperature storage tests are conducted at 120 °C, 150 °C, 180 °C, and 200 °C for different time periods. Unlike the well-known void formation in the Ni/Sn/Ni system, there is no such void at all in the Cu/Sn/Cu system. The addition of Ag consistently slows down the growth kinetics of intermetallics. The time-to-impingement of intermetallics is established for the first time for both systems under solid-state reactions.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 605, 25 August 2014, Pages 193-198
Journal: Journal of Alloys and Compounds - Volume 605, 25 August 2014, Pages 193-198
نویسندگان
T.L. Yang, J.J. Yu, W.L. Shih, C.H. Hsueh, C.R. Kao,