کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
8017840 1517227 2015 10 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Improved adhesion of Ni/Cu/Ag plated contacts with thermally formed nickel silicon interface for C-SI solar cells
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
Improved adhesion of Ni/Cu/Ag plated contacts with thermally formed nickel silicon interface for C-SI solar cells
چکیده انگلیسی
In this work the copper (Cu) conducting electrode was appraised as an alternative to standard screen printed silver (Ag) front contacts. Laser ablation and photolithography based wet chemical etching were adapted to pattern and analyze adhesion for reliable crystalline silicon (C-Si) solar cell technology. Nickel (Ni) surface treatment after the sintering process contributed to an improved Cu plating with an adhesive Ni-Cu interface. The soldering process for the pull tab adhesion test has an impact on adhesion strength and could reduce the overall value. Smoother surfaces resulted in lower adhesion values in comparison to rough surfaces. Excellent adhesion greater than wafer breakage force with an average value of 1.72 N/mm and maximum adhesion strength of 4.6 N/mm on laser-ablated surfaces were achieved.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Letters - Volume 161, 15 December 2015, Pages 181-184
نویسندگان
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