کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
795251 | 1466761 | 2008 | 8 صفحه PDF | دانلود رایگان |
The effects of an additional processing using pressure and heat treatment, that is, a “post-process”, on crack suppression and residual stress are investigated in BaTiO3-based multilayer ceramic capacitors (MLCCs) with Y5V characteristics. At the planes (margins) parallel to the electrode, the crack length is dramatically reduced after the post-process in the direction parallel to the electrode, without a change in the direction perpendicular to the electrode. At the plane perpendicular to the electrode, the crack length is modestly reduced in both parallel and perpendicular directions. The post-process is effective in reducing the difference in crack length between directions at each plane. The residual tensile stresses induced at the planes of the MLCCs before the post-process are converted to the compressive stresses and the residual compressive stresses are enhanced through the post-process. The MLCCs after the post-process show the residual compressive stress of approximately 300 MPa throughout entire planes.
Journal: Journal of Materials Processing Technology - Volume 205, Issues 1–3, 26 August 2008, Pages 160–167