کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
7956024 | 1513819 | 2013 | 10 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Thermodynamic reassessment of Au-Ni-Sn ternary system
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
دانش مواد (عمومی)
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Thermodynamic reassessment of Au-Ni-Sn ternary system Thermodynamic reassessment of Au-Ni-Sn ternary system](/preview/png/7956024.png)
چکیده انگلیسی
For having a better understanding on the formation and evolution of metal bonding interconnection microstructures the Au-Ni-Sn ternary system was reassessed on the basis of experimental results and the recently reported thermodynamical description for Au-Sn and Ni-Sn systems. In this paper, the thermodynamic parameters of Ni3Sn4 phase were modified in order to achieve a better agreement with experimentally determined phase boundaries. Further, a self-consistent set of thermodynamic parameters for the Au-Ni-Sn system were obtained, which were able to reproduce most of the available experimental data. The Ni|80Au20Sn (wt%) diffusion couples were annealed at 320 °C for 10,000 s and at 150 °C for 2500 h. The microstructures of these samples were studied with SEM+EDS technique. The reaction interface between Ni and near eutectic AuSn alloy consisted of Ni3Sn/(Ni, Au)3Sn2/AuSn/Au5Sn layers. This experimentally observed diffusion path of Ni against Au-20 wt% Sn solder at 150 °C was rationalized on the basis of the thermodynamically calculated isothermal section.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Calphad - Volume 43, December 2013, Pages 61-70
Journal: Calphad - Volume 43, December 2013, Pages 61-70
نویسندگان
H.Q. Dong, V. Vuorinen, T. Laurila, M. Paulasto-Kröckel,