Investigations of adhesion between waveguide and InP-laser with finger structure bonding

In this study, we focused on benzocyclobutene (BCB) coatings, finger structure bonding, and adhesion observation. To investigate a microdisk laser operating at a wavelength of 1310 nm, a system involving the use of 2 mm × 2 mm InP laser chips (bonded using divinyl siloxane-BCB through 2 cm × 2 cm hybrid laser processes), silicon-on-insulator wafer waveguides, a processing approach, and investigations based on chip architecture photographs was used. The I-V curve measured under the needle showed the feasibility of laser operation at a current of approximately 30 mA at 1.5 V. The maximum optical power was approximately 2.2 μW at 40 mA.