کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
796352 | 1466773 | 2007 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Processing treatment of a lead-free Sn–Ag–Cu–Bi solder by rapid laser-beam reflowing and the creep property of its soldered connection
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موضوعات مرتبط
مهندسی و علوم پایه
سایر رشته های مهندسی
مهندسی صنعتی و تولید
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
In this study, the processing performance of a lead-free Sn–Ag–Cu–Bi solder after rapid laser-beam reflowing was investigated, and the creep behaviors of the soldered joints were evaluated under different homologue temperatures from 0.68 to 0.82, with a systematical comparison to that of a Sn60Pb40 solder. The results show that after rapid laser-beam reflowing treatment the strength of the solder connections has been increased obviously and this is mainly due to grain refining effect and the Cu alloying effect; the lead-free Sn–Ag–Cu–Bi solder joints show a superior creep resistance in terms of a much lower creep rate and the elongated creep fracture lifetime over the traditional Sn–Pb solder.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Materials Processing Technology - Volumes 192–193, 1 October 2007, Pages 539–542
Journal: Journal of Materials Processing Technology - Volumes 192–193, 1 October 2007, Pages 539–542
نویسندگان
X.P. Zhang, C.B. Yu, Y.P. Zhang, S. Shrestha, L. Dorn,