Keywords: لحیم کاری بدون سرب; Thermomigration; Lead-free solder; Under bump metallization; Sn grain orientation; Intermetallic compound
مقالات ISI ترجمه شده لحیم کاری بدون سرب
مقالات ISI لحیم کاری بدون سرب (ترجمه نشده)
مقالات زیر هنوز به فارسی ترجمه نشده اند.
در صورتی که به ترجمه آماده هر یک از مقالات زیر نیاز داشته باشید، می توانید سفارش دهید تا مترجمان با تجربه این مجموعه در اسرع وقت آن را برای شما ترجمه نمایند.
در صورتی که به ترجمه آماده هر یک از مقالات زیر نیاز داشته باشید، می توانید سفارش دهید تا مترجمان با تجربه این مجموعه در اسرع وقت آن را برای شما ترجمه نمایند.
Keywords: لحیم کاری بدون سرب; Whiskers; Intermetallic compounds; Lead-free solder; X-ray diffraction;
Keywords: لحیم کاری بدون سرب; Lead-free solder; Precipitation strengthening; Solid solution strengthening; Strain rate sensitivity;
Keywords: لحیم کاری بدون سرب; Lead-free solder; Subgrain rotation; Grain boundaries; Grain orientation; Recrystallization;
Keywords: لحیم کاری بدون سرب; Lead-free solder; IMC; Microstructure; Interfacial reaction layer; Automotive application;
Keywords: لحیم کاری بدون سرب; Intergranular fatigue fracture; Lead-free solder; Crystal plasticity; Cohesive zone; Finite element modeling;
Keywords: لحیم کاری بدون سرب; Lead-free solder; Nanocomposite; Sn-Cu; SiO2; Mechanical properties; Microstructure; Wettability;
Keywords: لحیم کاری بدون سرب; Lead-free solder; Eutectic Sn-Ag-Cu alloy; Nanocomposite; Graphene nano-sheets; Ni-coating; Mechanical alloying;
Keywords: لحیم کاری بدون سرب; Tin; Sn; Micromechanics; Size-effect; Synchrotron diffraction; Plasticity; Lead-free solder;
Keywords: لحیم کاری بدون سرب; Ball grid array; Lead-free solder; Dynamic impact; Solder joint failure; Finite element method;
Keywords: لحیم کاری بدون سرب; Lead-free solder; Surface microstructure; Wetting; Laser processing;
Keywords: لحیم کاری بدون سرب; Lead-free solder; Microstructure; Mechanical properties; Intermetallic compound;
Keywords: لحیم کاری بدون سرب; Lead-free solder; Eutectic tin alloy; Nanocomposite; Al2O3; Melt spinning;
Keywords: لحیم کاری بدون سرب; Lead-free solder; Induction heating; Interfacial reaction; Microstructure; Mechanical reliability;
Keywords: لحیم کاری بدون سرب; Floating solder; Gridfinger interruption at busbar; Crack; Electroluminescent; Eddy current; Lead-free solder;
Keywords: لحیم کاری بدون سرب; Solder joint reliability; Resistor assembly; Lead-free solder; Component standoff height; Homologous temperature; Taguchi experimental design; Finite element modelling; Fatigue damage; Accelerated thermal cycling
Keywords: لحیم کاری بدون سرب; Lead-free solder; Creep; Shear punch creep test;
Keywords: لحیم کاری بدون سرب; Whisker growth; Lead-free solder; Inclusion; Image method
Keywords: لحیم کاری بدون سرب; Ag–Sn alloy; Eutectic temperature; Lead-free solder; Nanoparticles; Nanophase diagram
Keywords: لحیم کاری بدون سرب; Finite element analysis; Lead-Free solder; Crystal plasticity; Electron backscattering diffraction (EBSD); Plastic shear deformation
Keywords: لحیم کاری بدون سرب; Soldering; Lead-free solder; Intermetallic compounds; Interfacial reactions; Nanocomposite solders
Enhancement of the mechanical strength of Sn-3.0Ag-0.5Cu/Ni joints via doping minor Ni into solder alloy
Keywords: لحیم کاری بدون سرب; Lead-free solder; Ni addition; Microstructure; Deformation and fracture;
Effect of temperature on the fracture behavior of Cu/SAC305/Cu solder joints
Keywords: لحیم کاری بدون سرب; Temperature effect; Lead-free solder; Intermetallics; SAC305 fracture; J-integral; Interface fracture;
Corrosion mechanism of Zn-30Sn high-temperature, lead-free solder in neutral NaCl solution
Keywords: لحیم کاری بدون سرب; Lead-free solder; XPS; SIMS; Corrosion mechanism; Clâ;
Interfacial IMC growth of SAC305/Cu joint with a novel dual-layer of Ni(P)/Cu plating during solid-state aging
Keywords: لحیم کاری بدون سرب; Lead-free solder; Aging temperature; Cu/Ni(P) plating; IMCs growth; Thermal aging;
Influence of dual ceramic nanomaterials on the solderability and interfacial reactions between lead-free Sn-Ag-Cu and a Cu conductor
Keywords: لحیم کاری بدون سرب; Lead-free solder; Nanomaterials; Nanocomposite solder; Spreadability; IMC growth;
Solder Volume Effect on Interfacial Reaction between Sn-Ag-Cu/ENImAg Substrate
Keywords: لحیم کاری بدون سرب; Reflow soldering; lead-free solder; intermetallic compound; ENImAg; surface finish;
Effects of sulfur addition on the wettability and corrosion resistance of Sn-0.7Cu lead-free solder
Keywords: لحیم کاری بدون سرب; Lead-free solder; Su-Cu; Sulfur; Wettability; Corrosion;
Bonding Characteristics of Sn-57Bi-1Ag Low-Temperature Lead-Free Solder to Gold-Plated Copper
Keywords: لحیم کاری بدون سرب; Sn-57Bi-1Ag; Lead-free solder; Melting properties; Diffusion; Au-Sn IMC;
Fracture Behaviors of Miniature Size Specimens of Sn-5Sb Lead-Free Solder under Tensile and Fatigue Conditions
Keywords: لحیم کاری بدون سرب; Lead-free solder; Sn-5Sb; Miniature size specimen; Fatigue properties; Fracture behaviors;
Influence of small addition of antimony (Sb) on thermal behavior, microstructural and tensile properties of Sn-9.0Zn-0.5Al Pb-free solder alloy
Keywords: لحیم کاری بدون سرب; Sn-Zn-A-Sb alloys; Lead-free solder; Microstructure; Thermal properties; Tensile strength; Mechanical properties;
Shear strength and fracture behavior of reflowed Sn3.0Ag0.5Cu/Cu solder joints under various strain rates
Keywords: لحیم کاری بدون سرب; Shear strength; Fracture behavior; Lead-free solder; Strain rate;
Effects of Mn nanoparticles on tensile properties of low-Ag Sn-0.3Ag-0.7Cu-xMn solder alloys and joints
Keywords: لحیم کاری بدون سرب; Lead-free solder; Mn nanoparticles; Tensile properties; Stain rate; Test temperature; Aging time;
Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments
Keywords: لحیم کاری بدون سرب; Lead-free solder; Annealing; Residual stress; Nanoindentation; Constitutive behaviour;
Recommended values for the βSn solidus line in Sn-Bi alloys
Keywords: لحیم کاری بدون سرب; Thermal analysis; Phase diagram; Equilibration; Lead-free solder;
Separation of Sn, Bi, Cu from Pb-free solder paste by ammonia leaching followed by hydrochloric acid leaching
Keywords: لحیم کاری بدون سرب; Lead-free solder; Ammonia leaching; Hydrochloric acid leaching; Recycling;
Mechanical properties and fracture mechanisms of Sn-3.0Ag-0.5Cu solder alloys and joints at cryogenic temperatures
Keywords: لحیم کاری بدون سرب; Mechanical characterization; Fracture; Cryogenic temperatures; Strain rate; Lead-free solder;
Theoretical prediction of thermodynamic activities of liquid Au-Sn-X (X=Bi, Sb, Zn) solder systems
Keywords: لحیم کاری بدون سرب; Lead-free solder; Au-Bi-Sn; Au-Sb-Sn; Au-Sn-Zn; Activity; High-temperature solder;
Reinforcement of graphene nanosheets on the microstructure and properties of Sn58Bi lead-free solder
Keywords: لحیم کاری بدون سرب; Graphene nanosheets; Lead-free solder; Microstructure; Mechanical properties; Creep performance;
Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates
Keywords: لحیم کاری بدون سرب; Lead-free solder; Reflow soldering; Microstructure; Intermetallic; Interfacial reaction; Shear strength;
Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates
Keywords: لحیم کاری بدون سرب; Lead-free solder; Low Ag content solder; Crystal orientation; Growth kinetics; Interfacial reaction;
Influence of bismuth on the solidification of Sn-0.7Cu-0.05Ni-xBi/Cu joints
Keywords: لحیم کاری بدون سرب; Intermetallics; Microstructure; Phase diagrams; Thermal analysis; Lead-free solder;
Fracture toughness of intermetallic Cu6Sn5 in lead-free solder microelectronics
Keywords: لحیم کاری بدون سرب; Lead-free solder; Cu6Sn5; Small-scale testing; Fracture toughness;
The effect of aging temperature on the phenomena occurring at the interface of solder SnZn with Na on Cu substrate
Keywords: لحیم کاری بدون سرب; Aging; Soldering; Intermetallic compounds; Lead-free solder;
Mechanical deformation behavior and mechanism of Sn-58Bi solder alloys under different temperatures and strain rates
Keywords: لحیم کاری بدون سرب; Mechanical characterization; Deformation and fracture; In-Situ tension test; Nanoindentation; Lead-free solder;
Impact toughness, hardness and shear strength of Fe and Bi added Sn-1Ag-0.5Cu lead-free solders
Keywords: لحیم کاری بدون سرب; SAC105; Lead-free solder; Fe/Bi additives; Impact toughness; Hardness; Shear strength
Effects of indium on the intermetallic layer between low-Ag SAC0307-xIn lead-free solders and Cu substrate
Keywords: لحیم کاری بدون سرب; Metals and alloys; Lead-free solder; Interface; Intermetallics
Improvement in Intermetallic Thickness and Joint Strength in Carbon Nanotube Composite Sn-3.5Ag Lead-free Solder
Keywords: لحیم کاری بدون سرب; Lead-free solder; Sn-Ag; Intermetallic; carbon nanotube; Cu-Sn
Effects of Ag content on the interfacial reactions between liquid Sn-Ag-Cu solders and Cu substrates during soldering
Keywords: لحیم کاری بدون سرب; Lead-free solder; Sn-Ag-Cu; Interfacial reaction; Intermetallic compounds; Crystal growth and orientation;
Correlation between microstructure and mechanical properties of Sn-Bi-X solders
Keywords: لحیم کاری بدون سرب; Sn-Bi; Shear test; Tensile test; Bi coarsening; Lead-free solder; Intermetallic compounds;