کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
7168738 | 1463030 | 2018 | 9 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Effect of temperature on the fracture behavior of Cu/SAC305/Cu solder joints
دانلود مقاله + سفارش ترجمه
دانلود مقاله ISI انگلیسی
رایگان برای ایرانیان
کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
سایر رشته های مهندسی
مهندسی مکانیک
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Effect of temperature on the fracture behavior of Cu/SAC305/Cu solder joints Effect of temperature on the fracture behavior of Cu/SAC305/Cu solder joints](/preview/png/7168738.png)
چکیده انگلیسی
Double cantilever beam (DCB) specimens consisting of Sn96.5Ag3.0Cu0.5 (SAC305) solder sandwiched between two copper bars were fabricated under standard surface mount processing conditions. Mode-I fracture tests were performed on the DCB specimens under various temperatures. The load-displacement behavior and critical loads corresponding to crack initiation were recorded and used in a finite element model of the DCB to evaluate critical energy release rates. Fracture surfaces were analyzed to understand the effect of temperature on crack path and fracture mechanism. The critical energy release rate decreased from 603 at â50â¯Â°C to 93â¯J/m2 at 100â¯Â°C and the crack path shifted from solder/intermetallic compound interface to bulk solder.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Engineering Fracture Mechanics - Volume 199, August 2018, Pages 730-738
Journal: Engineering Fracture Mechanics - Volume 199, August 2018, Pages 730-738
نویسندگان
Patrick B. Thompson, Richard Johnson, Siva P.V. Nadimpalli,