Interfacial IMC growth of SAC305/Cu joint with a novel dual-layer of Ni(P)/Cu plating during solid-state aging

Interfacial IMC growth of SAC305/Cu joint with a novel dual-layer of Ni(P)/Cu plating during solid-state aging

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronic Engineering - Volume 199, 5 November 2018, Pages 69-79

Yongqiang Wan, Xiaowu Hu, Tao Xu, Yulong Li, Xiongxin Jiang,