کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
5455995 | 1514647 | 2017 | 16 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
دانش مواد (عمومی)
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments](/preview/png/5455995.png)
چکیده انگلیسی
In this study, residual stress in Sn-3.0Ag-0.5Cu lead-free solder after annealing at varying temperature and duration was investigated by nanoindentation and uniaxial tensile experiments. Based on the unloading response of load-penetration depth, the contact stiffness was theoretically calculated and found to be decreased with increasing annealing duration especially at the annealing temperature of 210 °C. Additionally, the effect of residual stress on constitutive behaviour at strain rates of 1Ã10â3 sâ1, 5Ã10â4 sâ1 and 1Ã10â4 sâ1 was consistently observed. By correlating residual stress and elastic indentation recovery, it was confirmed that greater contact stiffness is induced by greater compressive residual stress. Therefore, the optimal annealing condition of SAC305 solder is 210 °C for 12 h, which is believed to minimize the residual stress and stabilize the mechanical property of annealed solder.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Science and Engineering: A - Volume 696, 1 June 2017, Pages 90-95
Journal: Materials Science and Engineering: A - Volume 696, 1 June 2017, Pages 90-95
نویسندگان
Xu Long, Shaobin Wang, Yihui Feng, Yao Yao, Leon M. Keer,