Ultrafine gradient microstructure induced by severe plastic deformation under sliding contact conditions in copper

Sliding contact induces severe plastic deformation (SPD) at the surface of ductile materials and induces a microstructural gradient associated to a significant increase of hardness toward the surface. This gradient allows observing all stages of grain refinement in SPD, as illustrated here by the analysis of polycrystalline electrolytic copper tested in a coaxial tribometer. Materials tested in the cold-rolled state and after annealing were characterised by high-resolution electron backscattering diffraction and nano-indentation. The incremental plastic strain produces an ultrafine microstructure in the top layers, which gradually changes to the original size in unaffected material. In cold-rolled material, an intermediate recrystallised layer is observed. The separation of the Misorientation Angle Distribution (MAD) in a low-angle portion and a high angle portion allows characterising the accumulation of strain induced misorientation, while the Kernel Average Misorientation (KAM) provides information on the evolution of substructure at the finest levels. The results point toward a process where strain-induced effects compete continuously with recrystallisation, except for the surface layer in the cold-rolled material, where dynamic recrystallisation is dominant. Combining the information from KAM and subgrain size distribution, the measured hardness can be explained as a combination of grain size and dislocation hardening.