Deformation mechanism during dynamic loading of an additively manufactured AlSi10Mg_200C

A DMLS-AlSi10Mg_200C was subjected to dynamic loading at two strain rates. At 1680 s−1, an ultrafine substructure formed inside the α-Al dendrites due to dynamic recovery (DRV). At 4300 s−1, continuous dynamic recrystallization (CDRX) occurred, followed by DRV inside the DRX grains with development of nanoscale subgrains.