کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
7973861 | 1514631 | 2018 | 8 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
High temperature stabilization of a nanostructured Cu-Y2O3 composite through microalloying with Ti
دانلود مقاله + سفارش ترجمه
دانلود مقاله ISI انگلیسی
رایگان برای ایرانیان
کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
دانش مواد (عمومی)
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: High temperature stabilization of a nanostructured Cu-Y2O3 composite through microalloying with Ti High temperature stabilization of a nanostructured Cu-Y2O3 composite through microalloying with Ti](/preview/png/7973861.png)
چکیده انگلیسی
The effects of minor additions (0.2, 0.4 and 0.8 wt%) of Ti on the thermal stability of both Cu nanograins and Y2O3 particles in nanostructured Cu-5 vol%Y2O3 composite powder particles were investigated via 1 h isochronal annealing at temperatures ranging from 300 to 1000 °C. It was found that a small amount addition of 0.4 wt%Ti effectively inhibits the coarsening of the Y2O3 particles during annealing at a very high homologous temperature of 0.87Tm, where Tm is the melting point of Cu, which, in turn, stabilizes Cu nanograins and retains the hardness value of the as-milled powder sample. However, this is in clear contrast with the significant decrease in hardness of the Ti-free and 0.2 wt%Ti doped milled powder samples annealed at the same condition, resulting from the coarsening of the Y2O3 particles and growth of Cu nanograins. The energy dispersive X-ray spectrometry elemental analysis shows that the stabilizing mechanisms responsible for the improved thermal stability of the Y2O3 particles are associated with the chemical reactions between Ti, O and Y2O3.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Science and Engineering: A - Volume 712, 17 January 2018, Pages 80-87
Journal: Materials Science and Engineering: A - Volume 712, 17 January 2018, Pages 80-87
نویسندگان
Dengshan Zhou, Hongwei Geng, Wei Zeng, Dengqi Zheng, Hucheng Pan, Charlie Kong, Paul Munroe, Gang Sha, Challapalli Suryanarayana, Deliang Zhang,