Balancing the strength and ductility of carbon nanotubes reinforced copper matrix composites with microlaminated structure and interdiffusion interface

Microlaminated carbon nanotubes (CNTs) reinforced Cu matrix composites were prepared by combination of composite electrodeposition and spark plasma sintering (SPS). Interdiffusion transition regions formed between CNTs and Cu matrix under high sintering temperature, which were responsible for the balanced strength and ductility of the composites.