کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
7980390 | 1514730 | 2014 | 21 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Fracture behavior and adhesion energy of nanostructured Cu/Mo multilayer films
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
دانش مواد (عمومی)
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
The fracture behavior and interfacial adhesion of Cu/Mo nanostructured multilayer films (NMFs) are systematically investigated as a function of modulation period λ. A fracture mode transition from opening to shear has been reported as λ decreases from 250 nm to 10 nm, which is related to the constraining effect of ductile Cu layers on microcrack-initiating Mo layers. Within the λ regime below a critical size (λcri) of ~50 nm, a λ-independent adhesion energy of about 2.8 J mâ2 has been determined. Within the λ regime greater than λcri, however, the measured adhesion energy increases with increasing λ. The λ dependence of evaluated adhesion energy is discussed according to the size-dependent deformation mechanism. A micromechanics model has been utilized to quantify the λcri, where the deformation mechanism is transited from dislocation pileup to confined layer slip.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Science and Engineering: A - Volume 613, 8 September 2014, Pages 130-135
Journal: Materials Science and Engineering: A - Volume 613, 8 September 2014, Pages 130-135
نویسندگان
K. Wu, J.Y. Zhang, P. Zhang, Y.Q. Wang, G. Liu, G.J. Zhang, J. Sun,