کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
7982215 | 1514757 | 2013 | 8 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Processing maps and microstructural evolution of isothermal compressed Al-Cu-Li alloy
ترجمه فارسی عنوان
نقشه های پردازش و تکامل میکرو سازگار با آلیاژ آلکوی لیتیوم فشرده شده با ایزوترمال
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کلمات کلیدی
آلیاژ آلومینیوم کو؟ تغییر شکل فشرده سازی داغ، نقشه های پردازش، تکامل میکرو سازگار،
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
دانش مواد (عمومی)
چکیده انگلیسی
The hot deformation behavior of an Al-Cu-Li alloy was studied by isothermal compression in the temperature range of 573-773Â K with strain rates of 0.01-10Â sâ1 on a Gleeble-3500 thermo-mechanical simulator. The microstructural evolution during hot deformation was investigated by optical microscope (OM) and transmission electrical microscope (TEM). The results show that the flow stress increases with decreasing deformation temperature and increasing strain rate. Processing maps at the strains of 0.3-0.8 are obtained by isothermal compression data and exhibit two flow instability domains (573-648Â K at 0.014-1.5Â sâ1 and 698-773Â K at 0.3-10Â sâ1) and two peak efficiency domains (723-773Â K at 0.01-0.1Â sâ1 and 573-623Â K at 0.01-0.03Â sâ1). The strain has a significant effect on the peak efficiencies, and the peak efficiencies increase almost linearly as the strain increases. Dynamic recrystallization takes places at high temperatures (673-773Â K) and low strain rates (0.01-0.1Â sâ1). The second phases precipitating dynamically during hot deformation pin dislocations and boundaries of subgrains and restrain the occurrence of dynamic recrystallization, resulting in a higher temperature for dynamic recrystallization. According to the processing maps and microstructural observation, the optimized processing condition of hot deformation for Al-Cu-Li alloy is at 723-773Â K and 0.01-0.1Â sâ1.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Science and Engineering: A - Volume 586, 1 December 2013, Pages 115-122
Journal: Materials Science and Engineering: A - Volume 586, 1 December 2013, Pages 115-122
نویسندگان
Hao Yin, Hongying Li, Xiongjie Su, Desheng Huang,