Evolution behavior and growth kinetics of intermetallic compounds at Sn/Cu interface during multiple reflows

Evolution behavior and growth kinetics of intermetallic compounds at Sn/Cu interface during multiple reflows

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Intermetallics - Volume 96, May 2018, Pages 1-12

H.R. Ma, A. Kunwar, S.Y. Shang, C.R. Jiang, Y.P. Wang, H.T. Ma, N. Zhao,