The growth of intermetallic compound in Cu/Sn3.5Ag/Au solder joints under current stressing

► A Cu/Sn3.5Ag/Au solder joint was investigated under current stressing. ► The growth kinetics of Cu-Sn, Au-Sn IMCs was studied under current stressing. ► The mechanisms of crack and void formation were investigated. ► The correlation between void and Au-Sn IMCs formed was proposed.