کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
800822 1467512 2010 8 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Characterization of the interface adhesion of elastic–plastic thin film/rigid substrate systems using a pressurized blister test numerical model
موضوعات مرتبط
مهندسی و علوم پایه سایر رشته های مهندسی مهندسی مکانیک
پیش نمایش صفحه اول مقاله
Characterization of the interface adhesion of elastic–plastic thin film/rigid substrate systems using a pressurized blister test numerical model
چکیده انگلیسی

The quality of interface adhesion of an elastic–plastic thin film/rigid substrate system can be characterized by its interface adhesion energy. To estimate the interface adhesion energy, a numerical model for the pressurized blister test has been proposed, which includes three steps: dimensional, forward and reverse analyses. The dimensional analysis is applied to derive a preliminary nondimensional relationship of the interface adhesion energy, and then the forward and reverse analyses are carried out to establish its explicit form and to extract the interface adhesion energy, respectively. The results are in good agreement with experimental measurements, which confirms the effectiveness of the model.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Mechanics of Materials - Volume 42, Issue 10, October 2010, Pages 908–915
نویسندگان
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