کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
800822 | 1467512 | 2010 | 8 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Characterization of the interface adhesion of elastic–plastic thin film/rigid substrate systems using a pressurized blister test numerical model
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موضوعات مرتبط
مهندسی و علوم پایه
سایر رشته های مهندسی
مهندسی مکانیک
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چکیده انگلیسی
The quality of interface adhesion of an elastic–plastic thin film/rigid substrate system can be characterized by its interface adhesion energy. To estimate the interface adhesion energy, a numerical model for the pressurized blister test has been proposed, which includes three steps: dimensional, forward and reverse analyses. The dimensional analysis is applied to derive a preliminary nondimensional relationship of the interface adhesion energy, and then the forward and reverse analyses are carried out to establish its explicit form and to extract the interface adhesion energy, respectively. The results are in good agreement with experimental measurements, which confirms the effectiveness of the model.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Mechanics of Materials - Volume 42, Issue 10, October 2010, Pages 908–915
Journal: Mechanics of Materials - Volume 42, Issue 10, October 2010, Pages 908–915
نویسندگان
Limei Jiang, Yichun Zhou, Hongxiao Hao, Yanguo Liao, Chunsheng Lu,