Thermal stability and high-temperature shape memory effect of Ni55.2Mn24.7Ga19.9Gd0.2 thin film

Thermal stability and shape memory effect (SME) of Ni-Mn-Ga-based thin film were firstly investigated. The fluctuation scope of phase transformation temperatures did not exceed 2 °C during 100 thermal cycles. The maximum SME of 0.64% was quantitatively measured under 600 MPa applied stress. SME almost kept constant after 20 times thermal cycling deformation under 300 MPa applied stress.