Precision machining of micro tool electrodes in micro EDM for drilling array micro holes

• A tangential feed (TF) WEDG is proposed for precision machining of micro tool electrodes.
• A hybrid process based on TF-WEDG is presented for high processing efficiency.
• A cyclic alternating process with TF-WEDG is implemented for precision array micro-holes.

Micro electro discharge machining (micro EDM) is suitable for machining micro holes on metal alloy materials, and the micro holes can be machined even to several microns by use of wire electro discharge grinding (WEDG) of micro electrodes. However, considering practicability of micro holes <Φ100 μm in batch processing, the controllable accuracy of holes’ diameter, the consistency accuracy of repeated machining and the processing efficiency are required to be systematically improved. On the basis of conventional WEDG method, a tangential feed WEDG (TF-WEDG) method combined with on-line measurement using a charge coupled device (CCD) was proposed for improving on-line machining accuracy of micro electrodes. In TF-WEDG, removal resolution of micro-electrode diameter (the minimum thickness to be removed from micro electrode) is greatly improved by feeding the electrode along the tangential direction of wire-guide arc, and the resolution is further improved by employing negative polarity machining. Taking advantage of the high removal resolution, the precise diameter of micro-electrode can be achieved by the tangential feed of electrode to a certain position after diameter feedback of on-line measurement. Furthermore, a hybrid process was presented by combining the TF-WEDG method and a self-drilled holes method to improve the machining efficiency of micro electrodes. A cyclic alternating process of micro-electrode repeated machining and micro holes’ drilling was implemented for array micro holes with high consistency accuracy. Micro-EDM experiments were carried out for verifying the proposed methods and processes, and the experimental results show that the repeated machining accuracy of micro electrodes was less than 2 μm and the consistency accuracy of array micro holes was ±1.1 μm.