Production of radio frequency magnetron plasma by monopole arrangement of magnets for target uniform utilization

The monopole magnet arrangement under sputtering target has been proposed to improve target utilization in radio frequency magnetron plasma. Magnetic field analysis simulation indicates that a magnetic tunnel on the sputtering target for the monopole arrangement increases twice as much as that for the conventional arrangement. The profiles of the ion flux to the target and the target erosion depth has been investigated at three magnet spacings of 10, 30 and 70 mm. It is found that radial profile of the ion flux is almost similar to radial profile of the magnetic flux density in radial direction which is an important component for magnetron discharge at all magnet spacings. The ion flux profile has become uniform with decreasing the spacing although the ion flux decreases with reducing the spacing. The erosion profile of the target corresponds to the ion flux profile near the target at three spacings. The Cu target utilization percentage increases with decreasing the spacing and attains the highest value of 59% at the spacing 10 mm. It is obtained that the resistivity of Cu thin film deposited is approximately 4.6 × 10−8 Ωm, which is almost of the same order with the bulk resistivity.