Thermal stability and electrical properties of Ag-Ti films and Ti/Ag/Ti films prepared by sputtering

► Ag-Ti alloy film shows agglomeration suppression effect by forming thin Ti oxide layer at the film surface by annealing. ► Ti/Ag/Ti film shows the same effect and lower electrical resistivity than the alloy film. ► Ti interface layer can enhance adhesion between the Si oxide substrate and Ag film. ► Ti is useful as well as Al to suppress agglomeration phenomenon of Ag thin film.