کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
8049899 1519284 2018 6 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Influence of Open-circuit Voltage on Micro Electrical Discharge Machining of Ni-Al2O3 Functionally Graded Materials
موضوعات مرتبط
مهندسی و علوم پایه سایر رشته های مهندسی مهندسی صنعتی و تولید
پیش نمایش صفحه اول مقاله
Influence of Open-circuit Voltage on Micro Electrical Discharge Machining of Ni-Al2O3 Functionally Graded Materials
چکیده انگلیسی
Ni-Al2O3 functionally graded materials (FGMs) have become important for high temperature applications due to a continuous change in composition. However, the manufacturing of Ni-Al2O3 FGMs with conventional machining methods is a difficult process because of the high hardness and various graded compositions. In this paper, three-layerd Ni-Al2O3 FGMs, pure Ni layer (100% Ni), 70% Ni/30%Al2O3 layer, 30% Ni/70%Al2O3 layer, have been machined by micro electrical discharge machining (EDM). The machining characteristics of Ni-Al2O3 FGMs have been investigated, which include the effect of open-circuit voltage on material removal rate (MRR), electrical discharge status, surface microtopography, and element distribution. The experimental results indicate that with the increasing open-circuit voltage, the MRR of the pure Ni layer and 70% Ni/30%Al2O3 layer increases slowly and the surface quality becomes worse slowly. In contrast, when open-circuit voltage is changed from 110 to 170 V, the MRR of 30% Ni/70%Al2O3 layer increases rapdily. The surface quality of 30% Ni/70%Al2O3 layer becomes better before getting worse with the increase of open-circuit voltage. In addition, the quantity of normal discharges in the pure Ni layer and 70% Ni/30%Al2O3 layer has a little change, and the quantity of normal discharges in the 30% Ni/70%Al2O3 layer increases rapidly with the increase of open-circuit voltage. Finally, a small hole with fast MRR and good surface quality has been machined suceesfually based on the experimental analysis.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Procedia CIRP - Volume 68, 2018, Pages 5-10
نویسندگان
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