Influence of Rapid Solidification of Cu-P Intermediate Alloy on Wear Resistance of Al-Si alloy

The influence of rapid solidification of Cu-P intermediate alloy on the wear resistance of Al-Si alloy is studied. TEM analysis indicates that at the cooling speed of 105-106 °C/s, the microstructure of melt-spin Cu-P ribbon consists of nano-grains and a little amount of amorphous areas, and the grain size of Cu3P in Cu-P intermediate alloy is decreased from 5-40 μm to 30-50 nm. Results show that the wear resistance of Al-Si alloy modified by melt-spin intermediate alloy are better than that of Al-Si alloy modified by massive ones; wear rate is decreased from 0.86% to 0.39%. Therefore, melt-spin treatment of Cu-P intermediate alloy is effective to improve the wear resistance of Al-Si alloy.