Direct bonded HOPG - Analyzer support without background source

A new production process allows a direct bonding of HOPG crystals on Si wafers. This new method facilitates the production of analyzer crystals with support structure without the use of additional, background inducing fixation material, e.g. glue, wax and screws. This new method is especially interesting for the upcoming generation of CAMEA-type multiplexing spectrometers. These instruments allow for a drastic performance increase due to the increased angular coverage and multiple energy analysis. Exploiting the transparency of multiple HOPG for cold neutrons, a consecutive arrangement of HOPG analyzer crystals per Q-channel can be achieved. This implies that neutrons travel through up to 10 arrays of analyzer crystals before reaching the analyzer corresponding to their energy. Hence, a careful choice of the fixation method for the analyzer crystals in regards to transparency and background is necessary. Here, we present first results on the diffraction and mechanical performance of direct bonded analyzer crystals.