Microstructure and fatigue strength of high-strength Cu–Fe and Cu–V in-situ nanocomposite wires

The results of the quantitative analysis of the microstructure of the Cu–Fe and Cu–V in-situ nanocomposite wires with diameter of 0.44–0.80 mm by transmission electron microscopy are presented. Comparative fatigue tests of Cu–Fe and Cu–V in-situ nanocomposite wires and pure copper samples have been carried out using a dynamic mechanical analyzer (DMA). The in-situ nanocomposites have significantly higher characteristics of low-cycle fatigue failure resistance as compared to that of pure copper. The fatigue crack propagation areas for the nanocomposite conductors and pure copper are characterized by fatigue striations and secondary cracking.