Numerical simulations for class A surface finish in resin transfer moulding process

Simulation tools for Liquid Composite Moulding (LCM) processes are a key to predict and solve manufacturing issues. Despite the fact that numerical process analyses are commonly used to predict mould filling, resin cure and exothermic temperatures, more comprehensive computational tools are still required. Resin additives such as low profile additives (LPA) show a significant impact on process performance and part quality. In this work, mould pre-heating experiments were compared to numerical predictions using commercial simulation software. Non-isothermal simulations were then carried out and the predicted flow and degree-of-cure evolution were compared to experiments. Finally, a volume change model, previously developed, was implemented in this work to calculate mould pressure increases in RTM of resins with four different LPA contents (0%, 5%, 10% and 40%). The predictions were compared to the results from the mould pressure transducers in the mould cavity. Simulation results matched closely with the experimental results. Pressure evolution of low profile resins was found to be very sensitive to the model parameters.