کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
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820320 | 1469531 | 2014 | 8 صفحه PDF | دانلود رایگان |
The increasing integration of microelectronics, raising the need for effective heat dissipation, requires new and improved composite materials technologies. For both thermal interface and die attach materials, a major challenge is to combine low thermal resistance joints with sufficient thermomechanical decoupling and reliability. In this paper, we present the fabrication and characterisation of a new type of solder matrix nano polymer composite (SMNPC) aiming to address these challenges. The SMNPC is fabricated into preforms by liquid-phase infiltration of a Sn–Ag–Cu matrix into a silver nanoparticle coated electrospun polyimide fibre mesh. The composite is demonstrated to possess high heat transfer capability, close to that of a direct soldered interface, lower elastic modulus compared to pure Sn–Ag–Cu alloy, and reliable thermomechanical performance during thermal cycling. Taken together, the results indicate that the developed SMNPC can be a useful composite alternative compared to conventional solders and polymer matrix materials for thermal management applications.
Journal: Composites Science and Technology - Volume 94, 9 April 2014, Pages 54–61