کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
820438 | 1469536 | 2013 | 8 صفحه PDF | دانلود رایگان |

An additive-assisted copper electroplating technique designed for infiltrating high-aspect-ratio pores was adapted to work with three-dimensional wood-derived graphitic scaffolds with aspect ratios ranging from 15 to 300. The poor wettability of the carbon/copper system necessitates the development of alternative infiltration techniques to produce composite structures from highly porous precursors such as wood-derived graphite. By incorporating electrolyte additives, copper infiltration was demonstrated into red oak-derived graphite scaffolds, producing a composite with a biologically-derived microstructure. Copper infiltration was studied as a function of electrolyte chemistry and deposition time in two dimensions using electron microscopy techniques and in three dimensions using X-ray computed tomography.
Journal: Composites Science and Technology - Volume 89, 13 December 2013, Pages 61–68