Full recovery of fiber/matrix interfacial bond strength using a microencapsulated solvent-based healing system

Full recovery of interfacial bond strength after complete fiber/matrix debonding is achieved with a microencapsulated solvent-based healing chemistry. The surface of a glass fiber is functionalized with microcapsules containing varying concentrations of reactive epoxy resin and ethyl phenylacetate (EPA) solvent. Microbond specimens consisting of a single fiber and a microdroplet of epoxy are tested, and the interfacial shear strengths (IFSSs) during the initial (virgin) debonding and subsequent healing events are measured. Debonding of the fiber/matrix interface ruptures the capsules, releasing resin and solvent into the crack plane. The solvent swells the matrix, initiating transport of residual amine functionality for further curing with the epoxy resin delivered to the crack plane. Using a resin-solvent ratio of 3:97, we achieve a maximum of 100% IFSS recovery–a significant enhancement over prior work that reported 44% average recovery of IFSS with microencapsulated dicyclopentadiene (DCPD) monomer and Grubbs’ 1st Generation catalyst healing agents. The effects of capsule coverage, resin-solvent ratio, and capsule size on recovery of IFSS are also determined, providing guidelines for integration of this healing system into high fiber volume fraction structural composites. High healing efficiencies were achieved with capsules as small as 0.6 μm average diameter.